Machinability of Small Diameter Hole for Circuit Connection in Multi-Layer AFRP Printed Wiring Boards. Comparison between Kevlar Fiber and Thecnora Fiber Reinforcement.
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چکیده
منابع مشابه
Interconnection Evaluation Technology for Printed Wiring Boards
As a developer of world-class products including server and network devices, Fujitsu recognizes the printed wiring board (PWB) as a core component among the various components of those products. One basic element supporting high-quality PWBs is through-hole interconnection reliability. Existing methods for evaluating interconnections typically involve temperature cycle tests that subject the PW...
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Printed Circuit Board (PCB) is an essential component of almost all electrical and electron ic equipments. The rapid growth of the use of such equipments has contributed enormously to the generation of large quantity of waste PCBs. The WPCBs not only contain valuable metals but also a large variety of hazardous materials. Conventional treatments of such WPCBs have their own limitations. By pyro...
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This document treats the crosstalk between parallel conductors. The conductors can represent either conductors in a multiconductor cable or traces on a printed circuit board (PCB). An analysis method based on a lumped circuit equivalent for the problem as well as a method to calculate the per unit length parameters are presented. The computed results are validated by comparison with measurement...
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In a world of ever-increasing electronic component complexity and pin count requirements for component packaging, focus is once again on the age-old question of "How do we preserve solderable surfaces between PWB manufacturing and assembly?" PCB manufacturers today are faced with the decision of which surface finish to offer their customers, while their customers struggle with choosing the best...
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ژورنال
عنوان ژورنال: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
سال: 2002
ISSN: 0387-5008,1884-8338
DOI: 10.1299/kikaia.68.258